JPH01241809A - 積層セラミックチップ部品 - Google Patents
積層セラミックチップ部品Info
- Publication number
- JPH01241809A JPH01241809A JP7054888A JP7054888A JPH01241809A JP H01241809 A JPH01241809 A JP H01241809A JP 7054888 A JP7054888 A JP 7054888A JP 7054888 A JP7054888 A JP 7054888A JP H01241809 A JPH01241809 A JP H01241809A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductive metal
- platinum
- external electrode
- ceramic chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 40
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 23
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 20
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 13
- 239000010410 layer Substances 0.000 claims description 27
- 239000011247 coating layer Substances 0.000 claims description 7
- 239000003985 ceramic capacitor Substances 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 11
- 239000011521 glass Substances 0.000 abstract description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 230000006866 deterioration Effects 0.000 abstract description 4
- 239000001257 hydrogen Substances 0.000 abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 238000004544 sputter deposition Methods 0.000 abstract description 4
- 238000007747 plating Methods 0.000 abstract description 3
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000012360 testing method Methods 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 244000062175 Fittonia argyroneura Species 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7054888A JPH01241809A (ja) | 1988-03-23 | 1988-03-23 | 積層セラミックチップ部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7054888A JPH01241809A (ja) | 1988-03-23 | 1988-03-23 | 積層セラミックチップ部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01241809A true JPH01241809A (ja) | 1989-09-26 |
| JPH0440849B2 JPH0440849B2 (en]) | 1992-07-06 |
Family
ID=13434682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7054888A Granted JPH01241809A (ja) | 1988-03-23 | 1988-03-23 | 積層セラミックチップ部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01241809A (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03175711A (ja) * | 1989-12-04 | 1991-07-30 | Murata Mfg Co Ltd | チップ型電子部品 |
| CN105679478A (zh) * | 2016-01-27 | 2016-06-15 | 深圳顺络电子股份有限公司 | 一种小尺寸片式热敏电阻及其制作方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497768A (en) * | 1978-01-06 | 1979-08-02 | Sprague Electric Co | Monolithic ceramic condenser |
| JPS54156158A (en) * | 1978-05-30 | 1979-12-08 | Matsushita Electric Ind Co Ltd | Method of producing laminated ceramic varister |
| JPS54157296A (en) * | 1978-06-02 | 1979-12-12 | Tdk Corp | Electrode structure and the manufacturing method |
| JPS5558031A (en) * | 1978-10-26 | 1980-04-30 | Youtarou Fujita | Automatic descending apparatus in automatic pruning machine |
| JPS5571016A (en) * | 1978-11-22 | 1980-05-28 | Tdk Electronics Co Ltd | Method of manufacturing laminated porcelain capacitor |
| JPS5866321A (ja) * | 1981-10-15 | 1983-04-20 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
| JPS58182811A (ja) * | 1982-04-21 | 1983-10-25 | 株式会社日立製作所 | コンデンサ取付構造 |
| JPS5969907A (ja) * | 1982-10-15 | 1984-04-20 | 松下電器産業株式会社 | 温度補償用積層セラミツクコンデンサ |
| JPS59202618A (ja) * | 1983-04-30 | 1984-11-16 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
| JPS60120510A (ja) * | 1983-12-02 | 1985-06-28 | 松下電器産業株式会社 | 積層セラミックコンデンサの端子電極形成方法 |
-
1988
- 1988-03-23 JP JP7054888A patent/JPH01241809A/ja active Granted
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5497768A (en) * | 1978-01-06 | 1979-08-02 | Sprague Electric Co | Monolithic ceramic condenser |
| JPS54156158A (en) * | 1978-05-30 | 1979-12-08 | Matsushita Electric Ind Co Ltd | Method of producing laminated ceramic varister |
| JPS54157296A (en) * | 1978-06-02 | 1979-12-12 | Tdk Corp | Electrode structure and the manufacturing method |
| JPS5558031A (en) * | 1978-10-26 | 1980-04-30 | Youtarou Fujita | Automatic descending apparatus in automatic pruning machine |
| JPS5571016A (en) * | 1978-11-22 | 1980-05-28 | Tdk Electronics Co Ltd | Method of manufacturing laminated porcelain capacitor |
| JPS5866321A (ja) * | 1981-10-15 | 1983-04-20 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
| JPS58182811A (ja) * | 1982-04-21 | 1983-10-25 | 株式会社日立製作所 | コンデンサ取付構造 |
| JPS5969907A (ja) * | 1982-10-15 | 1984-04-20 | 松下電器産業株式会社 | 温度補償用積層セラミツクコンデンサ |
| JPS59202618A (ja) * | 1983-04-30 | 1984-11-16 | 松下電器産業株式会社 | 積層セラミツクコンデンサの製造方法 |
| JPS60120510A (ja) * | 1983-12-02 | 1985-06-28 | 松下電器産業株式会社 | 積層セラミックコンデンサの端子電極形成方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03175711A (ja) * | 1989-12-04 | 1991-07-30 | Murata Mfg Co Ltd | チップ型電子部品 |
| CN105679478A (zh) * | 2016-01-27 | 2016-06-15 | 深圳顺络电子股份有限公司 | 一种小尺寸片式热敏电阻及其制作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0440849B2 (en]) | 1992-07-06 |
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